| abstract |
Hot-melt silicone pressure sensitive adhesive compositions containing organic waxes, methods of using the compositions and devices made using the compositions are disclosed. The hot-melt silicone pressure sensitive adhesive compositions include a mixture of (i) a silicate resin, (ii) a silicone fluid, and (iii) an organic wax having a melting point of between 30 DEG C. and 150 DEG C. The organic wax decreases dynamic viscosity of the adhesive at temperatures equal to or below about 200 DEG C. |