| abstract |
PCT No. PCT/JP94/00232 Sec. 371 Date Oct. 17, 1994 Sec. 102(e) Date Oct. 17, 1994 PCT Filed Feb. 16, 1994 PCT Pub. No. WO94/19410 PCT Pub. Date Sep. 1, 1994There is provided a resin composition having well balanced moldability, heat resistance and mechanical strength, which comprises (A) all aromatic polyamideimide resin and (B) a Polyester resin, (C) a polyphenylene sulfide resin or (D) a resin capable of forming an anisotropic molten phase, said aromatic polyamideimide resin containing 5 to 95 mol % of a recurring unit of the formula (1) and 5 to 95 mol % of at least one of a recurring unit of the formula (2) and a recurring unit of the formula (3). Said aromatic polyamideimide resin is prepared by conducting a polymerization reaction of an aromatic tricarboxylic acid anhydride and at least any one of all aromatic dicarboxylic acid and an aliphatic dicarboxylic acid with a diisocyanate compound in plural steps in which in the first step the polymerization reaction is conducted in a temperature range of 50 DEG to 110 DEG C. and in the second and subsequent steps the polymerization reaction is conducted in a temperature range of higher than 110 DEG C. but not higher than 200 DEG C. <IMAGE> (1) <IMAGE> (2) <IMAGE> (3) wherein Ar denotes a trivalent aromatic group, Ar1 denotes a divalent aromatic group, R1 denotes a divalent aliphatic group, and R denotes a divalent aromatic or aliphatic group. |