| abstract |
A process for manufacturing a transparent conductive film wiring board capable of being practiced according to a dry procedure to simplify the manufacturing and reduce the manufacturing costs. First, a SiO 2 layer is provided on a substrate and then a black ITO film is formed on the SiO 2 layer. The black ITO film is subject to processing using laser emitted from an output horn, resulting in being cut into a predetermined wiring pattern. Metal evaporated by laser processing is sucked by a vacuum suction head. Then, the substrate is subject to calcination to oxidize and crystallize the black ITO film 3 of the wiring pattern to form a transparent ITO film of the wiring pattern. |