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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-088
filingDate 1995-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1996-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07d843449570cd4e1688a183a9cc4c26
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publicationDate 1996-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5527722-A
titleOfInvention Method of fabrication of a semiconductor device having high-and low-voltage MOS transistors
abstract A semiconductor device (76) is provided with a high-voltage portion including NMOS transistor (78) and PMOS transistor (82b) and a low-voltage portion including NMOS transistor (80) and PMOS transistor 82(a). The high-voltage NMOS transistor (78) includes source/drain regions (90a, 90b) having N- regions (90a 1 , 90b 1 ) that are self-aligned with a gate (78) and N+ regions (90a 2 , 90b 2 ) that are self-aligned with sidewall spacers (91) formed on sidewalls of the gate (78) to improve reliability under continuous high voltage operating conditions. The low voltage NMOS transistor includes source/drain regions (92a, 92b) that are self-aligned with sidewall spacers (92) to permit channel lengths to be scaled to less than 2 microns. The low-voltage PMOS transistor (82a) and high-voltage PMOS transistor (82b) include source/drain regions (116a-16d) that are self-aligned with sidewall spacer extension regions (110a) formed over sidewall spacers (91) permitting low-voltage PMOS transistor channel lengths to be scaled to less than 2 microns.
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Total number of triples: 54.