| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
1995-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1996-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_057f92fab344c644627151003ebc6808
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d67169aef85e39791a3afd9b4da2600
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99270e04cf5cad9d207293ecfe97b68c |
| publicationDate |
1996-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5510446-A |
| titleOfInvention |
Method of preparing naphthol-modified phenolic resin and epoxy resin molding material for sealing electronic parts |
| abstract |
A naphthol-modified phenolic resin having low softening point and good flowability is obtained by allowing a naphthol and a phenol to react with an aldehyde in the presence of an acid catalyst at 60 to 110 DEG C. to obtain a primary reaction mixture, heating the primary reaction mixture in the presence of a strong acid, a super acid or a mixture thereof under ambient pressure at 120 to 180 DEG C. for 1 to 12 hours to obtain a secondary reaction mixture, and subjecting the secondary reaction mixture to vacuum concentration or steam distillation, and the naphthol-modified phenolic resin is suited to use as a curing agent in epoxy resin molding materials for sealing electronic parts. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012308832-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8394911-B2 |
| priorityDate |
1993-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |