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filingDate 1994-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1995-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1995-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5431718-A
titleOfInvention High adhesion, solderable, metallization materials
abstract A high adhesion strength, co-fireable, solderable silver metallization material for use with low-fire ceramics is provided. The metallization material includes the metallization powder as well as a binder vehicle, and an adhesion promoting agent. The combination of elements allows a metallization material which can be cofired at relatively low temperatures necessary for firing ceramic substrate materials while providing an adequate base for soldering subsequent circuit components to the ceramic substrate.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006289840-A1
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