| abstract |
Pressure-sensitive adhesive (PSA) compositions containing a crystalline polymeric additive having an Mw of less than 25,000 and a melting point (Ta) greater than 23 DEG C., preferably 30 DEG to 60 DEG , and PSA composites of a backing, preferably a flexible backing, with such a PSA composition coated thereon. The presence of the additive causes the PSA to lose adhesive strength when heated to Ta. The base resin of the PSA is preferably a polyacrylate or a styrene/butadiene copolymer. The additive, which is preferably present in amount 1 to 35%, e.g. 5 to 30%, is preferably a side chain crystallizable (SCC) polymer. |