| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-66 |
| filingDate |
1993-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1995-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c6cefc120ac0e54941c9710d6f30738 |
| publicationDate |
1995-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5406120-A |
| titleOfInvention |
Hermetically sealed semiconductor ceramic package |
| abstract |
A ceramic hermetic package is provided having conductive material bonded into apertures in the ceramic housing that connect with a die mounted on a thin substrate through wire and pad connections. The substrate has a heat sink affixed to the bottom and electrical connections are formed on the opposite face of the package from the heat sink so that the encased semiconductor may be mounted on circuit boards in either a vertical position or in a position where the heat sink is horizontal but facing upward. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009127675-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9072203-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018159239-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6787467-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5747877-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007230145-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010020513-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5785236-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-RE45279-E
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-RE45175-E
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6147408-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7838990-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006202337-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1471572-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011279991-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5650760-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5561322-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002150692-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6391775-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6222276-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015021780-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5977630-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6410431-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5621616-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7348680-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5661089-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9006901-B2 |
| priorityDate |
1992-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |