| abstract |
The instant invention pertains to a hot-melt pressure sensitive adhesive composition wherein the composition is comprised of a mixture of (i) a silicone resin and (ii) a silicone fluid, the mixture exhibiting tackiness and adhesiveness, the mixture being blended with (B) from about 1.0 to 20 weight percent, based on the total weight of the mixture of (i) and (ii), of a siloxylated allyloxypropane diol copolymer. The instant invention also encompasses method of using the composition, methods of making hot-melt silicone pressure sensitive adhesive-coated substrates, and devices made using the composition. |