| abstract |
A method for producing a multilayered ceramic substrate including the steps of: n forming at least two green sheets each including a low-temperature firing glass-ceramic substrate material, n forming an electrode pattern and a via hole electrode on and through each green sheet with a conductor paste, n laminating said green sheets to obtain a laminate, n forming a pair of green sheets which include an inorganic material which is not sintered at a firing temperature of the green sheet of the low-temperature firing glass-ceramic substrate material or lower, and then forming a hole through the inorganic material green sheet, n laminating the inorganic material green sheet on the outermost green sheet of the laminate to obtain a resultant laminate in which the hole is positioned over a portion of the electrode pattern of an outermost low-temperature firing glass-ceramic green sheets of the laminate, n firing said resultant laminate at the firing temperature, and n removing the unsintered inorganic material. The substrate does not shrink in its plane direction and surface smoothness, electrical resistance and solderability of the top layer wiring pattern are improved. |