| abstract |
A curable composition comprising an oxyalkylene polymer having a silicon-containing hydrolyzable group and a low-molecular silicon compound having a hydrolyzable group bonded to a silicon atom which is more reactive to H2O than the oxyalkylene polymer, with the mole number of the total hydrolyzable groups in said low-molecular silicon compound being not more than that of the hydrolyzable groups in said oxyalkylene polymer. A sealing compound having well-balanced storage stability and rapid curability is provided. |