| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ebf0cb1d1433dab281ed53b79845eed |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S205-92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0392
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0361
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12778
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate |
1992-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1994-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6b528d68cad4505d2782c5fe44f9d44 |
| publicationDate |
1994-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5336391-A |
| titleOfInvention |
Method for producing a circuit board material employing an improved electroplating bath |
| abstract |
An improved circuit board material having a support layer, an electrical resistance layer and a conductive layer. The circuit board material has a resistance of at least about 500 ohms/square. The circuit board material is formed by electro-plating the electrical resistance layer on the conductive layer. The conductive layer is desirably activated prior to electro-deposition of the electrical resistance layer thereon. The conductive layer is activated by contacting with an activating agent such as benzotriazole electrolytic chromate and the like. A preferred electro-plating bath for electro-deposition of the electrical resistance layer comprises about 0.5 mole per liters nickel hypophosphite. The disclosed electro-plating bath functions at ambient temperatures and is effectively temperature independent. Circuit boards can be formed from the circuit board material through a process involving only two etching steps. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6210592-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5662788-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6194990-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004113127-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7215235-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6232042-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7192654-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7189317-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009314531-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6753254-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7276442-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004201446-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7794578-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007215962-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6500350-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7862900-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7126195-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002195709-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004144656-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006188701-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6171952-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5944879-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006185140-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004192003-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7596842-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6440318-B1 |
| priorityDate |
1987-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |