| abstract |
A process for the preparation of carrier particles which comprises the dry coating of a carrier or carrier cores with conductive submicron polymeric particles containing from about 1 to about 50 weight percent of conductive fillers, and wherein said conductive polymer particles are prepared by mixing at least one monomer with a polymerization initiator, a crosslinking component and a chain transfer component; effecting bulk polymerization until from about 5 to about 50 weight percent of the monomer has been polymerized; terminating polymerization by cooling the partially polymerized monomer; adding thereto from about 1 to about 50 weight percent of a conductive filler or conductive fillers, followed by mixing thereof; dispersing the aforementioned mixture of conductive filler or fillers, and partially polymerized product in water containing a stabilizing component to obtain a suspension of particles with an average diameter of from about 0.05 to about 1 micron in water; polymerizing the resulting suspension by heating; subsequently washing and drying the product; thereafter heating the carrier core or carrier cores and the resulting conductive polymer particles to enable fusing thereof to said core or cores; and cooling the carrier particles obtained, which particles have a conductivity of from between about 10.sup. -4 to about 10 -10 mho-cm -1 . |