| abstract |
A cyanoacrylate monomer adhesive formulation which has improved thermal properties resulting from the inclusion in the formulation of an effective amount for enhancing the thermal resistance of the cured polymer of a sulfur containing compound of the formula: R1OSO2OR1 <IMAGE> R1OSOOR1 <IMAGE> R1SO2OR1 R1SOR1 R1SOOR1 or <IMAGE> where R1 and R2 are, respectively, monovalent and divalent hydrocarbon groups which may be optionally substituted with halogen, NO2, oxo, CN, alkoxy, hydroxy, acyloxy or SO2 or interrupted by one or more ether oxygen atoms. |