| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c7ad58d3c0b071069a8ee0cb8c8ba2e8 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0066 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L55-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L55-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L51-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L51-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L81-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L69-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L25-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate |
1993-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1994-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cb46ba71758eae301fae6f6e67411a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ffa50a6dad4ce79664631e0aa2e5873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7496fa84bfb312161a232dd8fe55893f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4e33cf5e06dfb10133f4490dad9e809
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26fae8e6a3f136e8fa7477aa175e1db9 |
| publicationDate |
1994-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5300550-A |
| titleOfInvention |
Thermoplastic molding compositions |
| abstract |
A thermoplastic molding composition is disclosed comprising n (i) a thermoplastic resin n (ii) a low molecular weight additive, and n (iii) a specially prepared carrier material magnesium-aluminum-silicate. n The carrier material which is characterized by its particle size and low bulk density was found to be effective in minimizing the thermal processing-related evaporation of the low molecular additive. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6617381-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6051641-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010104867-A1 |
| priorityDate |
1992-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |