| abstract |
A room temperature-curable organopolysiloxane composition which does not suffer from surface fissuring even when subjected to external stress (e.g., tensile stress, flexural stress) during the course of its cure was prepared and has a composition of a hydroxyl-terminated polydiorganosiloxane, a hydrophobic silica with a silanol titer not exceeding 2.0 mL, a dry-method silica with a silanol titer of at least 5.0 mL, and an oxime group-containing silane or siloxane. |