| abstract |
A strengthened polyimide film is described, which has improved adhesion when bonded to a metal foil through a heat-resistant adhesive, containing from 0.02 to 1% by weight, based on the weight of the film, of an organo-metallic compound wherein the metal is tin, bismuth or antimony. A process for preparing a strengthened polyimide film is also described wherein an organometallic compound is introduced into a film-forming polyamic acid polymer prior to the casting step. |