| abstract |
A resin circuit substrate includes: a plurality of electronic parts having electrodes to be electrically connected to each other, with surfaces of the electrodes being disposed flush with each other; a resin for integrally molding surfaces of the electronic parts other than the surfaces of the electrodes so that the electronic parts are retained with the resin; and a circuit pattern for electrically connecting the electrodes to each other, the circuit pattern being laminated on exposed surfaces of the electrodes. A method for manufacturing the resin circuit substrate includes the steps of: positioning the electronic parts on a base having a flat surface so that surfaces of the electrodes contact the flat surface of the base; molding the electronic parts so as to be integrated with the resin on the flat surface thereof to form a molded part; hardening, drying or aging the molded part integrated with the electronic parts; removing the base from the molded part; printing a conductive resin onto the molded part to form a circuit pattern in such a manner that the conductive resin is laminated on a surface, of the molded part, including the surfaces of the electrodes; and hardening or drying the conductive resin. |