| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S528-901
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-16 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5419
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-57
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5419 |
| filingDate |
1991-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1993-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abfd4573699a146d4c7dbdc6b47fea07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82036de2c6a33aedc9609a257f29b6e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8c47e922047e5e790a63f1038dc8643 |
| publicationDate |
1993-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5244938-A |
| titleOfInvention |
Room temperature curable organopolysiloxane composition |
| abstract |
The present invention is characterized by adding and mixing an organosilicon compound having alkoxy, groups and an ester linkage in the molecule represented by the following formula: ##STR1## in an amount of 1 to 20 parts by weight per 100 parts by weight of a trifluoropropylalkylpolysiloxane. Said organosilicon compound has a function as a storage stabilizer as well as a curing agent and, according to the present invention, an RTV fluorosilicone composition that has hitherto been difficult to be applied as an adhesive for electric and electronic parts has been made possible to be used in the particular field. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6020449-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5384384-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7534840-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6235832-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0885933-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5814695-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10384441-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007088123-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5371116-A |
| priorityDate |
1990-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |