| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-1444
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3218 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 |
| filingDate |
1991-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1993-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b310bf05eb2279a070a8d4e3be16990
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_420251efab2cb30b60bceee0fa729345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3af280f816f19d47c9a20fcf7ca04a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d296cef402099b61ca6e9876c10beb8b |
| publicationDate |
1993-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5225484-A |
| titleOfInvention |
Epoxy resin compositions and cured products thereof |
| abstract |
A composition comprising an epoxy resin and a curing agent is blended with a thermoplastic resin impregnated with an organic silicon compound to provide an epoxy resin composition which cures into products having improved adhesion and thermal impact and is suitable for encapsulating semiconductor devices. n The impregnated thermoplastic resin is formed by swelling the thermoplastic resin with a solvent and impregnating the swollen thermoplastic resin with the organic silicon compound. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7714080-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7095125-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002105093-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006199923-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008012156-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101373883-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100588301-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007185227-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7384682-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004034161-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100523594-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7192997-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022077542-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5977255-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7321005-B2 |
| priorityDate |
1990-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |