| abstract |
An epoxy composition suitable for adhesives, coatings and sealants is prepared from (a) at least one reaction product of an epoxy and amine-capped oligomer, (b) an epoxy adduct of dimer acid, (c) dicyandiamide and (d) a catalyst which yields a dimethyl amine radical upon being heated. When the epoxy composition is cured, it exhibits two glass transition temperatures and good adhesion properties at and below room temperature. The epoxy is particularly suitable for adhesives used in the manufacturing of automobiles. |