| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9fc0a00eab3a757e8324b1e887d7ba97 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-28 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28 |
| filingDate |
1991-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1993-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7bed4d7ac6597fa74ac3b533ac21f10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d101710e87432b0fd03369b77187143
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b350d49600653797610cb544885d1cd5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3e98678a8dc7a2691722316d4b573e3 |
| publicationDate |
1993-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5183692-A |
| titleOfInvention |
Polyimide coating having electroless metal plate |
| abstract |
A method for producing a coating composed of an electroless metal plate, such as a copper plate, tightly bonded to a polyimide layer comprises a multi-step cure of the polyimide layer carried out in combination with a palladium-catalyzed electroless deposition process. A solution of a polyamic acid compound that is the precursor for the desired polyimide resin in a vaporizable solvent is applied to a substrate and heated preferably to temperature below 250 DEG C., to form a soft-cured polyimide film. The film is immersed in an aqueous palladium-tin colloidal suspension to deposit the colloidal particles thereon, which particles are then activated to form palladium nuclei dspersed on the surface. The soft-cured film is then heated, preferably above about 250 DEG C., to vaporize residual solvent and form a hard-cured polyimide layer having the palladium nuclei dispersed on the surface. The hard-cured layer is immersed in an electroless metal plating solution, whereupon the palladium nuclei catalyze deposition of the metal to form a continuous plate. In one aspect of the method, the metal-clad layer is further heated between about 350 DEG C. and 450 DEG C. to final cure the polyimide. It is found that the plate of the coating formed by this multi-cure method strongly adheres to the polymer layer to permit extended deposition and thereby form a relatively thicker plate without catastrophic separation from the polymer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5631753-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6025057-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0231221-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5997997-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5348574-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0739996-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6534422-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-1299548-C
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5935652-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9501464-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5290597-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6342307-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106179501-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6344412-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0739996-A3 |
| priorityDate |
1991-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |