| abstract |
A two-step process for the preparation of a silicone resin-modified phenolic resin is disclosed wherein an alkoxysilane-modified phenolic resin is first prepared by reacting an alkoxysilane with a phenolic resin. In a subsequent step, the alkoxysilane-modified phenolic resin is hydrolyzed and condensed by heating and stirring it with water. The resulting silicone resin-modified phenolic resin, which is free of diorganopolysiloxane units, has excellent heat resistance and excellent electrical insulating properties. |