| abstract |
Pressure-sensitive adhesive composition comprising (a) a benzene soluble, resinous copolymer, (b) a diorganoalkenylsiloxy endblocked polydiorganosiloxane, (c) a diorganohydrogensiloxy endblocked polydiorganosiloxane, (d) an organosiloxane crosslinking agent containing more than two groups that will react with a silicon-bonded hydrogen of a diorganohydrogensiloxy endblocked polydiorganosiloxane by means of a hydrosilation reaction, said organosilicon compound being selected from organosiloxanes having 1 to 15 silicon atoms, and (e) a hydrosilation catalyst in an amount sufficient to effect curing of the composition. The major advantage of the present invention is that solvent need not be used to apply the composition. This non-use of solvent results in savings of material, time, and energy, and reduction in health and safety hazards. |