abstract |
PCT No. PCT/JP90/01013 Sec. 371 Date May 15, 1991 Sec. 102(e) Date May 15, 1991 PCT Filed Aug. 8, 1990 PCT Pub. No. WO91/01844 PCT Pub. Date Feb. 21, 1991.Disclosed is a soldering flux which prevents a release of an active ion contained in an activator when exposed to a high-temperature atmosphere maintaining at a temperature higher than 80 DEG C., for example, an atmosphere of an engine room of an automobile, and thus makes washing unnecessary. This soldering flux comprises, together with an activator, (1) a thermoplastic resin having a softening point not lower than 80 DEG C., and/or (2) an epoxy group-containing compound, a radical-polymerizable unsaturated double bond-containing compound or a blocked isocyanate group-containing compound, or (3) a thermosetting resin composed of a carboxyl group-containing resin and an epoxy resin and/or a thermosetting resin containing carboxy and epoxy groups. |