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filingDate 1990-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1992-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5160779-A
titleOfInvention Microprobe provided circuit substrate and method for producing the same
abstract A probe assembly for testing semiconductor wafer chips includes microprobes embedded in a circuit substrate. The microprobes are pillar-shaped conductors formed in through holes in a base of the substrate. One end of the microprobe is flush with the base surface contacts and is electrically connected through a reinforcing substrate to a probe assembly test head which generates various test signals. The other end of the pillar-shaped microprobes projects beyond the base to make contact with and deliver test signals to various electrodes of a chip to be tested.
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Total number of triples: 48.