| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-455 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-455
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate |
1990-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1992-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23cfb055bf88286becaa503a8173bab7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c428e2a9d6a42bbd821e498fdc08fd94 |
| publicationDate |
1992-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5143948-A |
| titleOfInvention |
Semiconductor element protecting compositions |
| abstract |
A polyimide resin is prepared by polymerizing (A) a tetracarboxylic acid dianhydride component consisting essentially of 10 to 50 mol % of 2,2-bis(3,4-benzene-dicarboxylic anhydride)perfluoropropane and 90 to 50 mol % of pyromellitic dianhydride or similar acid dianhydride and (B) a diamine component consisting essentially of 10 to 80 mol % of a silicon diamine and 90 to 20 mol % of an ether diamine. The polyimide resin is dissolved in an organic solvent and blended with finely divided silica to form a composition which is useful for protecting semiconductor elements. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7462654-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8071996-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9085893-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007009751-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005071741-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005071741-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1379594-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9196800-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007262426-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010044739-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002177646-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008161473-A1 |
| priorityDate |
1989-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |