http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5129982-A

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filingDate 1991-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1992-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b937417bb547c73a0e50d810dd99a4e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6beecd3ee113f99296ed0e61798fe2e7
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publicationDate 1992-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5129982-A
titleOfInvention Selective electrochemical etching
abstract A method of selectively etching a body of a semiconductor material, such as single crystalline silicon, having regions of n-type and p-type conductivity to remove at least a portion of the n-type region. The body is placed in an etching solution of an etchant having a high pH value and a positive voltage is applied between the body and the etchant. This forms passivating layers on the surfaces of the two regions with the passivating layer on the n-type region being different from that on the p-type region. The voltage is then removed and the body is etched for a period long enough to remove all of the passivating layer from the n-type region and at least a portion of the n-type region, but is not long enough to remove all of the passivating layer from the p-type region. This is allowed by the difference between the passivating layers on the two regions. The steps of forming the passivating layers and etching them is repeated until a desired amount of the n-type region is removed.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9849376-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8658544-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8193575-B2
priorityDate 1991-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 48.