| abstract |
A cured composition possessing excellent cohesive strength at high temperatures along with excellent adhesion, shear strength and solvent resistance is prepared by the high energy ionizing radiation initiated curing of a polymer composition comprising an alkenyl arene/conjugated diene block copolymer and a oligomer such that the unsaturation index of the composition is minimized. The radiation initiated curing of the adhesive composition is accomplished without requiring the aid of a coupling agent to promote crosslinking of the block copolymer during exposure to the radiation. |