| abstract |
A method of making a pattern on an electrically conductive material such as a printed circuit comprises n (i) electrodepositing on an electrically conductive surface a film of an organic polymer having, per average molecule, more than one reactive functional group, n (ii) forming on the electrodeposited film a predetermined pattern of a heat-curable resist having, per average molecule, more than one group reactive with the reactive groups in the electrodeposited film on heating, thereby leaving predetermined areas of the electrodeposited film uncovered, n (iii) removing the uncovered areas of the electrodeposited film by treatment with a solvent therefor, thereby forming a surface comprising bare conductive material in predetermined areas and, in other predetermined areas, conductive material coated by areas of the electrodeposited film covered by the resist, and n (iv) heating to complete adhesion of the resist to the electrically conductive surface through the areas of the electrodeposited film covered by the resist, n steps (iii) and (iv) being carried out in either order. |