Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89afae566b725ae78e20cf972d9bcdc7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2810-30 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F8-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-10 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F8-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-10 |
filingDate |
1989-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1992-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b5a94f57dd08908b0c50a9d6bb7ce84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_630cf31150518002d266c011187c21e2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f56523e12ad49886ee9280e548374938 |
publicationDate |
1992-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-5087552-A |
titleOfInvention |
Photosensitive resin composition |
abstract |
The invention provides a photosensitive resin composition useful as a solder resist, etching resist or plating resist in the manufacture of printed circuit boards to exhibit excellent resistance against heat and chemicals and good adhesion to the substrate surface. The composition essentially comprises (a) a copolymeric resin of an α,β-unsaturated dicarboxylic acid anhydride and an ethylenically unsaturated polymerizable compound, of which the acid anhydride units are partially esterified with an unsaturated alcohol and a saturated alcohol, and (b) a photopolymerization initiator. The composition may further comprise optional ingredients such as (c) a photopolymerizable monomeric compound, (d) an epoxy-based resin and (e) an aromatic diamine compound. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6828411-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002137818-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6007966-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004198861-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102142605-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6555593-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003212296-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5936005-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0839838-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0839838-A2 |
priorityDate |
1988-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |