| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0aaae00479c8b1b24221e4f3e983dbac |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S148-043 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76819 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
1989-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1991-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d2f2b9af7c930f878eb377215484014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7c0d59fd4b23ebc95ec3019a8dc1f2b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ccc622b20d8c9bb0dd3055cb1bd901a8 |
| publicationDate |
1991-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5070037-A |
| titleOfInvention |
Integrated circuit interconnect having dual dielectric intermediate layer |
| abstract |
This invention comprehends a multilevel electrically conductive interconnect for an integrated circuit wherein an inventive feature of the interconnect is the intermediate dual dielectric layer between the non-contacting portions of the surrounding metal conductors. The dual dielectric layer consists of a first dielectric layer and a second dielectric layer preferably formed from a polyimide material. The dual dielectric layer provides a significant improvement in defect density and a substantially planarized surface for the deposition of the top conductor, thereby improving the reliability and integrity of the electrical interconnection and integrated circuit. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5620919-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11127674-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008078995-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5656861-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5506173-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5371047-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002180047-A1 |
| priorityDate |
1989-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |