patent/US-5055321-A

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filingDate	1989-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	1991-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c979eb7385c9cec24764a16d3497a2d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ca1d95ddfb15d703f987763b76f7d3b
publicationDate	1991-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-5055321-A
titleOfInvention	Adhesive for electroless plating, printed circuit boards and method of producing the same
abstract	An adhesive for electroless plating is formed by dispersing particular heat-resistant granules easily soluble in an oxidizing agent into a particular heat-resistant resin sparingly soluble in the oxidizing agent through a curing treatment. A printed circuit board is manufactured by using such an adhesive.
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