| abstract |
The present invention relates to an unsaturated group-containing polycarboxylic acid resin produced by reacting an epoxidized compound of a condensate of a phenolic compound and an aromatic aldehyde having a phenolic hydroxyl group with (meth)acrylic acid, and further reacting the reaction product with polybasic carboxylic acid or an anhydride thereof; a composition comprising the resin and a cured product of the resin or the composition. n The composition according to the present invention is developable with an aqueous alkaline solution and suitable for a solder resist composition which is excellent in heat resistance, solvent resistance, adhesion, electric insulation property and storage stability. |