| abstract |
A thermally conductive silicone composition comprising: (A) 100 parts by weight of a polyorganosiloxane containing at least two silicon-bonded alkenyl groups per molecule and having a viscosity as measured at 25 DEG C. of 10 to 100,000 cP; (B) a polyorganohydrogensiloxane containing at least three silicon-bonded hydrogen atoms per molecule in an amount such that the number of silicon-bonded hydrogen atoms contained therein is 0.5 to 4.0 per alkenyl group contained in component (A); (C) a catalyst selected from the group consisting of platinum and platinum compounds, in an amount of 0.1 to 100 ppm by weight, in terms of the amount of platinum atoms, based on the amount of component (A); (D) 100 to 800 parts by weight of a heat transfer filler having an average particle diameter of 5 to 20 mu m and having a particle size distribution such that particles having a particle diameter of 5 mu m or less are 20% or more of the whole particles and particles having a particle diameter of 10 mu m or more are 20% or more of the whole particles; and (E) 0 to 20 parts by weight of an adhesion promoter. |