| abstract |
The invention consists of a process for pulse electroplating electroactive polymer substrates at potentials sufficient to cause reduction of the substrates. The inventive process can be used to make polymer-metal composites having one or more metal films. More specifically, it can be used to electroplate polyimide substrates with gold, or to electroplate gold over a copper plated polyimide substrate. These inventive composites exhibit improved polymer-metal adhesion when they are exposed to elevated temperatures and humidities, i.e., 85 DEG C. and 85% R.H. |