| abstract |
Polyamide-based molding compositions having enhanced flexibility and resilience, especially at low temperatures, are prepared from (1) semirigid copolyamides prepared from fatty acid dimers, (2) elastomers containing moieties compatible or reactive with such copolyamides (1) and comprising olefinic copolymers bearing carboxyl and/or carboxylate groups, copolyester-amides, polyurethanes, organopolysiloxane and polyurethane block copolymers, and copolymers produced from a latex which comprises suitable functional groups, and, optionally, (3) conventional polyamides. |