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filingDate 1989-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1990-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b813f00ee99371b3be8c521a6c8d212
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publicationDate 1990-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-4963893-A
titleOfInvention Heat-resistant insulating substrate, thermal printing head, and thermographic apparatus
abstract A layer of an amorphous substance containing at least one member from among hydrogen and halogen elements and using as main components thereof silicon and at least one member selected from among nitrogen, carbon, and oxygen is formed as a resin-protecting layer or an abrasion-resistant layer in a thermal printing head or as a resin-protecting layer in a heat-resistant insulating substrate. The hardness of the substrate itself is greatly improved by this layer of the amorphous substance. As the result, the substrate as a whole or the thermal printing head as a whole acquires high rigidity and improved resistance to crack.
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priorityDate 1988-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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