| abstract |
Functional films comprising a thermoplastic resin having formed thereon a coating layer and a process for their production are disclosed. The films have improved properties including improved heat resistance, are inexpensive, and are for general-purpose. They are produced by baking a thin film of a phenol resin, an epoxy resin, a silicone resin, etc., onto a thermoplastic resin substrate and can be utilized for flexible printed circuit base, insulating tapes, etc. |