| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05671
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S438-951
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05666
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485 |
| filingDate |
1988-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1989-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37dfbc1d08964f88e20c19b72695d777
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e13c7d6e6ef6cfae0a9610ae30bb307 |
| publicationDate |
1989-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-4861425-A |
| titleOfInvention |
Lift-off process for terminal metals |
| abstract |
A process is described for selective removal of unwanted metallization from the surface of a semiconductor device. The process comprises the usual deposition of a configurable image defining layer on the surface of the device upon which a suitable pad limiting metallurgy (PLM) has already been deposited. The layer is then opened over the pad limiting metallurgy using standard techniques and coated with a layer of the terminal metal. The coated device is then heated to just above the melting point of the terminal metal causing the melted metal, through surface tension to form a ball of metal on the PLM and to form small globules of metal on the surface of the layer and then permitted to cool. When cooled the layer is removed using the usual techniques. Because the coating of terminal metal is no longer a continuous layer on the surface of the mask, removal of the polymer mask can be accomplished in about one-tenth of the time required when compared to a deposited terminal metal layer that is not melted. Also because of the effects of surface tension the metal coating need only be one-half the thickness required under the prior art techniques. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102004005361-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102004005022-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5776801-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9202038-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6911390-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10156054-C2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10156054-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102004005361-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7172966-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7271095-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5756259-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005167284-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5904156-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5252180-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005186786-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5226232-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6156445-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5705570-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5384283-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10746612-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003092274-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102004023897-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102004005022-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5534094-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5672760-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5672260-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5411918-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5919868-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5933752-A |
| priorityDate |
1988-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |