| abstract |
A process for forming electroless copper plating patterns comprising: (a) laminating a substrate with a photocurable laminate, (b) exposing said photocurable laminate to a high energy ray, (c) removing unexposed parts of the laminate, and (d) electrolessly plating a desired pat of the laminate with copper; wherein said photocurable layer comprises (a) 100 parts by weight of a compound having recurring units represented by the following formulae [A] and [B] <IMAGE> [A] <IMAGE> [B] and (b) 5 to 1,000 parts by weight of a compound, which is compatible with compound (a), having a group represented by the formula -(R4)n wherein R4 is a group having a double bond and n is an integer of 1 to 50 and characterized by a viscosity at 20 DEG C. of from 0.001 to 500 poises. |