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filingDate 1988-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1989-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-4837408-A
titleOfInvention High density multilayer wiring board and the manufacturing thereof
abstract A multilayered wiring board comprising a plurality of green sheets of crystallizable glass which have a conductive pattern printed thereon. The green sheets are laminated together and sintered as a unit. The conductive composition used for the conductive pattern mainly comprises Cu or CuO with lesser amounts of MnO2. According to two embodiments the conductive composition additionally contains (1) Pd and/or Pt or (2) Ag2O and TiO2 or TiH2. Thereby volume contraction due CuO reduction cancels out volume expansion due to Cu oxidation in the subsequent degreasing.
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