| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48137
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1616
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-427 |
| filingDate |
1987-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1989-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3d7c580c4dbc9a22f137768c2180ab7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cc57d42439840cb4f0957720475c135
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be90c892014870f5ec38d6c8fe2ac7ff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b8c9418227aa955c4fedbee87b6aceb |
| publicationDate |
1989-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-4796155-A |
| titleOfInvention |
Liquid cooling type high frequency solid state device |
| abstract |
A liquid cooling type high frequency solid state device comprising: a solid state chip; at least one matching circuit connected to the solid state chip; a carrier for mounting the solid state chip and the matching circuit, constituting a solid state circuit to be cooled; a coolant vessel for containing a liquid coolant, with a space for coolant vapor at the top thereof; and an element for condensing the coolant vapor contained in the top space of the vessel. At least a part of the solid state circuit contacts the liquid coolant for boiling and evaporating the coolant. Amplitude modulation of the solid state circuit due to the boiling of the coolant is prevented. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6550531-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11121125-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008053640-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11493550-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010327629-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011139430-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-4022406-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5004973-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-4022406-C2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11334129-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11658175-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6820684-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009199999-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008011459-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5529115-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-D995530-S
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006169438-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9121090-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010117209-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8176972-B2 |
| priorityDate |
1983-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |