| abstract |
A modified polyolefin resin and a composition containing therein such modified polyolefin, having excellent adhesive property and heat-sealing property at the time of high speed forming operations, the modified polyolefin resin consisting essentially of: a copolymer of ethylene and alpha -olefin having 4 or more carbon atoms, the copolymer having a density in a range of from 0.890 to 0.910 g/cm3, a ratio of a weight-average molecular weight (Mw) to a number-average molecular weight (Mn) of Mw/Mn=2 to 15, and a product of a melt tension (g) and a melt-index (g/10 min.) of a molten resin measured at 160 DEG C. of 4 or below; and unsaturated carboxylic acid or derivatives thereof grafted on the ethylene type copolymer at a ratio of from 0.01 to 3% by weight. |