| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_040ec81c891acc3f3186f56cb99cf161 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2031-7146 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M50-557
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M50-553
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M50-172
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M6-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M6-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M50-548 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M50-548
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M50-553
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M6-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M6-16 |
| filingDate |
1987-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1988-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d72f9b35379b1cee677c9b93c413bd2 |
| publicationDate |
1988-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-4759771-A |
| titleOfInvention |
Packaging technique for batteries |
| abstract |
The invention covers a method of producing packaged batteries having high internal resistance utilizing semiconductor manufacturing techniques. These include forming an assembly for each battery to be formed of an anode plate and a cathode plate in spaced parallel relationship with a low concentration electrolyte in between the plates. The assembly is then arranged within a recess formed between upper and lower electrically conductive mold elements of a transfer mold. A temporary short circuit is thus created between the plates. The recess defines a battery package configuration. A plastic molding compound is then injected into the recess through a distribution aperture communication with the recess. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7230321-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6881371-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006267167-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9413405-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7557433-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005077604-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5227264-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9099410-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5386625-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100456528-C
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1343210-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1343210-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003173709-A1 |
| priorityDate |
1987-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |