| abstract |
An electroconductive resin paste, comprising a resin obtained by reacting 0.01 to 0.5 carboxylic acid equivalent of a homopolymer or a copolymer of butadiene having carboxylic acid terminal groups with 1 epoxy equivalent of an epoxy resin having two or more epoxy groups in one molecule, a curing agent and an electroconductive filler which is (i) an electroconductive metal powder or (ii) an inorganic insulating powder coated with a surface electroconductive film, said electroconductive filler being in an amount of from 60 to 95% by weight based on the resin and the electroconductive filler. |