| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f5e1b4b131354b8260c6050c9a2740c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2218-151
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2217-253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2217-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2217-268
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49149
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2218-154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2323-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-1345 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C17-40 |
| filingDate |
1986-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1988-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e4179c0fcbc6b22d4656cd1f251652c |
| publicationDate |
1988-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-4719134-A |
| titleOfInvention |
Solderable contact material |
| abstract |
It is often required to solder an electrical connection to a component or a lead thereto via a contact pad. At present pads are commonly of materials that tend to oxidize during any subsequent heat processing of the device, and are then difficult to solder. It has now been discovered that certain alloys of copper containing manganese may be used to construct contact pads that are both solderable and remain so even when ovened in air at 200 DEG C., and the invention provides a method of constructing solderable contact pads upon a chosen substrate, in which method there is formed on the relevant area of the substrate a layer of such a manganese/copper alloy. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4908275-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5152451-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8089158-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5004520-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5551626-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009290116-A1 |
| priorityDate |
1984-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |