| abstract |
Adhesion between surfaces of metal, reinforced plastics, glass, friction material or ceramics is effected using an adhesive comprising (a) an epoxide resin (b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide, isophthalic acid dihydrazide or adipic acid dihydrazide, and (c) as accelerator for the cure, and dispersed as a powder in (a) and (b), a solid solution of a nitrogen base having a boiling point above 130 DEG C. and a phenol-aldehyde resin. Typical nitrogen bases used in (c) include benzyldimethylamine, benzimidazole and 2-methylimidazole. Typical phenolic resins are those prepared from phenol and formaldehyde. |