| abstract |
A photopolymerizable composition is disclosed which comprises: (a) a free-radically polymerizable compound, (b) a polymeric binder, (c) a photopolymerization initiator, (d) a compound which is thermally crosslinkable with the polymeric binder, with a polymerization product of (a) or with itself, and (e) a pigment. The disclosed composition is used for applying markings to printed circuits and preferably is applied to the solder-resist layer using a dry-resist process, is exposed and then developed, either separately or together with the solder-resist layer. |