| abstract |
Silicon dioxide etching solutions with soluble surfactant additives are provided. The improved silicon dioxide etchants are produced by adding soluble fluorinated surfactant additives to standard oxide etchants in the manufacture of integrated circuits. The surfactants found effective in accordance with the invention are referred to as fluorinated cycloalkane sulfonates and fluorinated cycloalkene sulfonates and have the general formula <IMAGE> where X is F, H, Cl, OH, SO3A or R and Y is F, H, OH, R or be omitted and thereby impart a double bond; wherein R is a 1 to 4 fluoroalkyl group; and wherein n has a value of up to 6. A represents as the cation group may be NH4+, H+, Na+, K+, Li+, R+ or organic amine cations. |